- Afhalen na 1 uur in een winkel met voorraad
- Gratis thuislevering in België vanaf € 30
- Ruim aanbod met 7 miljoen producten
- Afhalen na 1 uur in een winkel met voorraad
- Gratis thuislevering in België vanaf € 30
- Ruim aanbod met 7 miljoen producten
Boeken geschreven door John H Lau
-
Solder Joint Reliability
John H Lau
- Hardcover | Engels
- Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic co... Lees meer
€ 349,45Levering 1 à 2 weken€ 349,45Levering 1 à 2 weken -
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
John H Lau
- Hardcover | Engels | Electronic Engineering
- Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online e... Lees meer
€ 202,95Levering 1 à 2 weken€ 202,95Levering 1 à 2 weken -
3D IC Integration and Packaging
John H Lau
- Hardcover | Engels
- Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online e... Lees meer
€ 273,95Levering 1 à 2 weken€ 273,95Levering 1 à 2 weken -
Assembly and Reliability of Lead-Free Solder Joints
John H Lau, Ning-Cheng Lee
- Paperback | Engels
- This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more we... Lees meer
€ 198,45Levering 2 à 3 weken€ 198,45Levering 2 à 3 weken -
Through-Silicon Vias for 3D Integration
John H Lau
- Hardcover | Engels
- Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online e... Lees meer
€ 224,95Levering 1 à 2 weken€ 224,95Levering 1 à 2 weken -
Assembly and Reliability of Lead-Free Solder Joints
John H Lau, Ning-Cheng Lee
- Hardcover | Engels
- This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more we... Lees meer
€ 231,45Levering 1 à 2 weken€ 231,45Levering 1 à 2 weken -
Solder Joint Reliability
John H Lau
- Paperback | Engels
- Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic co... Lees meer
€ 349,45Levering 1 à 2 weken€ 349,45Levering 1 à 2 weken -
Chip on Board
John H Lau
- Hardcover | Engels | E; Ectrical Engineering
- This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who w... Lees meer
€ 335,95Levering 2 à 3 weken€ 335,95Levering 2 à 3 weken -
Fan-Out Wafer-Level Packaging
John H Lau
- Hardcover | Engels
- This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. Lees meer
€ 153,95Levering 1 à 2 weken€ 153,95Levering 1 à 2 weken -
Mechanics of Solder Alloy Interconnects
Darrel R Frear, Steven N Burchett, Harold S Morgan, John H Lau
- Hardcover | Engels | Electrical Engineering
- The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to b... Lees meer
€ 335,95Levering 2 à 3 weken€ 335,95Levering 2 à 3 weken -
Handbook of Tape Automated Bonding
John H Lau
- Hardcover | Engels
- Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding,... Lees meer
€ 366,95Levering 1 à 2 weken€ 366,95Levering 1 à 2 weken -
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H Lau
- Hardcover | Engels
- This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both p... Lees meer
€ 209,95Verwachte leverdatum onbekend€ 209,95Verwachte leverdatum onbekend -
Fan-Out Wafer-Level Packaging
John H Lau
- Paperback | Engels
- This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. Lees meer
€ 139,95Verwachte leverdatum onbekend€ 139,95Verwachte leverdatum onbekend
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