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- Gratis thuislevering in België vanaf € 30
- Ruim aanbod met 7 miljoen producten
Omschrijving
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Proven 2D and 3D IC lead-free interconnect reliability techniques
Proven 2D and 3D IC lead-free interconnect reliability techniques
Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
Covers reliability of:
- 2D and 3D IC lead-free interconnects
- CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
- Lead-free (SACX) solder joints
- Low-temperature lead-free (SnBiAg) solder joints
- Solder joints with voids, high strain rate, and high ramp rate
- VCSEL and LED lead-free interconnects
- 3D LED and 3D MEMS with TSVs
- Chip-to-wafer (C2W) bonding and lead-free interconnects
- Wafer-to-wafer (W2W) bonding and lead-free interconnects
- 3D IC chip stacking with low-temperature bonding
- TSV interposers and lead-free interconnects
- Electromigration of lead-free microbumps for 3D IC integration
Specificaties
Betrokkenen
- Auteur(s):
- Uitgeverij:
Inhoud
- Aantal bladzijden:
- 640
- Taal:
- Engels
- Reeks:
Eigenschappen
- Productcode (EAN):
- 9780071753791
- Verschijningsdatum:
- 22/12/2010
- Uitvoering:
- Hardcover
- Formaat:
- Genaaid
- Afmetingen:
- 157 mm x 231 mm
- Gewicht:
- 907 g
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